Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact-Reference-Cited by-同舟云学术

Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact

Published:2008-08 Issue:8-9 Volume:48 Page:1149-1154
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Chou Chan-Yen,Hung Tuan-Yu,Yang Shin-Yueh,Yew Ming-Chih,Yang Wen-Kun,Chiang Kuo-Ning

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference12 articles.

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3. Reliability assessment for solders with a stress buffer layer using ball shear strength test and board-level finite element analysis;Yew;Microelectron Reliab,2007

4. The solder on rubber (SOR) Interconnection design and its reliability assessment based on shear strength test and finite element analysis;Yew;Microelectron Reliab,2006

5. Design, analysis and development of novel three-dimensional stacking WLCSP;Yuan;IEEE Trans Adv Packag,2005

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