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Design, analysis, and development of novel three-dimensional stacking WLCSP

  • Published:2005-08 Issue:3 Volume:28 Page:387-396
  • ISSN:1521-3323
  • Container-title:IEEE Transactions on Advanced Packaging
  • language:
  • Short-container-title:IEEE Trans. Adv. Packag.

Author:

Yuan C.-A.,Cheng Nan Han ,Ming-Chih Yew ,Chan-Yen Chou ,Kou-Ning Chiang

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Cited by 14 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Study on Gaussian Process Regression to Predict Reliability Life of Wafer Level Packaging with cluster analysis;2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2022-10-26

2. Predict the Reliability Life of Wafer Level Packaging using K-Nearest Neighbors algorithm with Cluster Analysis;2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2022-10-26

3. Predicting Wafer-Level Package Reliability Life Using Mixed Supervised and Unsupervised Machine Learning Algorithms;Materials;2022-05-30

4. Solder Joint Reliability Risk Estimation by AI-Assisted Simulation Framework with Genetic Algorithm to Optimize the Initial Parameters for AI Models;Materials;2021-08-26

5. Solder joint reliability risk estimation by AI modeling;2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2020-07
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