Multi-scale analysis of polysilicon MEMS sensors subject to accidental drops: Effect of packaging

Author:

Ghisi Aldo,Fachin Fabio,Mariani Stefano,Zerbini Sarah

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference21 articles.

1. Test methodology for durability estimation of surface mount interconnects under drop testing conditions;Varghese;Microelectron Reliab,2007

2. Dynamic responses and solder joint reliability under board level drop test;Luan;Microelectron Reliab,2007

3. CCGA packages for space applications;Ghaffarian;Microelectron Reliab,2006

4. The reliability of microelectromechanical systems (MEMS) in shock environments;Srikar;J Microelectromech Sys,2002

5. Cheng Z, Huang W, Cai X, Xu B, Luo L, Li X. Packaging effects on the performances of MEMS for high-g accelerometer: frequency domain and time-domain analyses. In: Proceedings of HDP’04, 2004. p. 282–289.

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