Dynamic responses and solder joint reliability under board level drop test-Reference-Cited by-同舟云学术

Dynamic responses and solder joint reliability under board level drop test

Published:2007-02 Issue:2-3 Volume:47 Page:450-460
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Luan Jing-en,Tee Tong Yan,Pek Eric,Lim Chwee Teck,Zhong Zhaowei

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference16 articles.

1. Lim CT, Low YJ. Drop impact testing of portable electronic products. In: 52nd ECTC conference proc., 2002. p. 1270–4.

2. Lim CT, Low YJ. Drop impact survey of portable electronic products. In: 53rd ECTC conference proc., 2003. p. 113–20.

3. JEDEC Standard JESD22-B111. Board level drop test method of components for handheld electronic products, 2003.

4. JEDEC Standard JESD22-B104-B. Mechanical shock, 2001.

5. JEDEC Standard JESD22-B110. Subassembly mechanical shock, 2001.

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