Test methodology for durability estimation of surface mount interconnects under drop testing conditions-Reference-Cited by-同舟云学术

Test methodology for durability estimation of surface mount interconnects under drop testing conditions

Published:2007-01 Issue:1 Volume:47 Page:93-103
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Varghese J.,Dasgupta A.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference33 articles.

1. JEDEC Standard JESD22-B104-B, Mechanical shock; 2001.

2. Methods for realistic drop testing;Goyal;Int J Microcircuits Electron Packag,2000

3. Lim CT, Low YJ. Investigating the drop impact of portable electronic products. In: Electronic components and technology conference; 2002.

4. Lim CT, Ang CW, Tan LB, Seah SKW, Wong EH. Drop impact survey of portable electronic products. In: Electronic components and technology conference; 2003.

5. Seah SKW, Lim CT, Wong EH, Tan VBC, Shim VPW. Mechanical response of PCBs in portable electronic products during drop impact. In: Electronic packaging and technology conference; 2002.

Cited by 26 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Survivability of embedded microelectronics in precision guided projectiles: Modeling and characterization;International Journal of Impact Engineering;2021-08

2. Assembly Options and Challenges for Electronic Products With Lead-Free Exemption;IEEE Access;2020

3. Reliability Study of Solder Joints in Electronic Packaging Technology;Harsh Environment Electronics;2019-03-29

4. Accidental Drop Impact;Mechanics of Microsystems;2018-02-12

5. A review of lead-free solders for electronics applications;Microelectronics Reliability;2017-08