ESD issues in advanced CMOS bulk and FinFET technologies: Processing, protection devices and circuit strategies

Author:

Russ Christian

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference32 articles.

1. International Technology Roadmap of Semiconductors (ITRS). .

2. Boselli G. Analysis of ESD protection components in 65nm CMOS technology: scaling perspective and impact on ESD design window. In: EOS/ESD symposium; 2005. p. 43–52.

3. Trends and challenges to ESD and latch-up designs for nanometer CMOS technologies;Boselli;Microelectron Reliab,2005

4. Gauthier R. Evaluation of diode-based and NMOS/Lnpn-based ESD protection strategies in a triple gate oxide thickness 0.13m CMOS logic technology. In: EOS/ESD symposium; 2001. p. 205–15.

5. Analysis of failure mechanism on gate-silicided and gate-non-silicided ESD NMOSFETs in a 65nm bulk CMOS technology;Li;IPFA,2006

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1. Enhancing ESD Performance of FinSCRs: Engineering Schemes to Address Current Localization and Failure Current Scalability;IEEE Transactions on Electron Devices;2023-08

2. ESD nMOSFETs in Advanced Bulk FinFET Technology With Dual S/D Epitaxy;IEEE Transactions on Electron Devices;2022-09

3. Design and Analysis of Energy-Efficient Logic Gates Using INDEP Short Gate FinFETs at 10 nm Technology Node;Lecture Notes in Electrical Engineering;2022

4. Metal Migration Induced Breakdown from Gate Contact in Bulk FinFET Devices;2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2021-09-15

5. Multi-Level Design Influences on Robustness Evaluation of 7nm FinFET Technology;IEEE Transactions on Circuits and Systems I: Regular Papers;2020-02

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