Underfill selection methodology for fine pitch Cu/low-k FCBGA packages-Reference-Cited by-同舟云学术

Underfill selection methodology for fine pitch Cu/low-k FCBGA packages

Published:2009-02 Issue:2 Volume:49 Page:150-162
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Ong Xuefen,Ho Soon Wee,Ong Yue Ying,Wai Leong Ching,Vaidyanathan Kripesh,Lim Yeow Kheng,Yeo David,Chan Kai Chong,Tan Juan Boon,Sohn Dong Kyun,Hsia Liang Choo,Chen Zhong

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference27 articles.

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4. Tran SK, Questad DL, Sammakia BG. Adhesion issues in flip-chip on organic modules. In: Proceedings of intersociety conference on thermal phenomena, 1998. p. 263–8.

5. Pearson RA, Hydro RM, Lloyd TB, Nied HF. The effect of temperature and humidity exposure on adhesion. In: Proc PASME Int Mech Eng Congr Expo Applicat; Fracture Mech Electronic Packaging; 1997.

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