Thermo-Mechanical Reworkable Epoxy Underfill in Board-Level Package: Material Characteristics and Reliability Criteria-Reference-Cited by-同舟云学术

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Thermo-Mechanical Reworkable Epoxy Underfill in Board-Level Package: Material Characteristics and Reliability Criteria

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
language:
Short-container-title:

Author:

Lip Teng Saw¹,Devarajan Mutharasu¹

Affiliation:

1. PTDI Western Digital,Material Centre of Excellence (MCoE),Batu Kawan,Malaysia

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816442.pdf?arnumber=9816442

Reference8 articles.

1. Underfill Flow in Flip-Chip Encapsulation Process: A Review

2. Underfill technology for fine pitch flip chip applications

3. Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding

4. Theoretical and Experimental Investigation of Warpage Evolution of Flip Chip Package on Packaging during Fabrication;hc;Materials (Basel),2021

5. New reworkable underfill adhesive for better process control;smyth,2021

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Solder joint reliability performance study and shear characterization of low-Ag SAC lead-free solders for handheld application;Materials Science in Semiconductor Processing;2024-08

2. Comparative study of solder joint reliability assessment on fan-out CSP and flip-chip DCA package;Journal of Materials Science: Materials in Electronics;2023-11

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