Strain behaviors of solder bump with underfill for flip chip package under thermal loading condition-Reference-Cited by-同舟云学术

Strain behaviors of solder bump with underfill for flip chip package under thermal loading condition

Published:2014-12 Issue:12 Volume:28 Page:4899-4906
ISSN:1738-494X
Container-title:Journal of Mechanical Science and Technology
language:en
Short-container-title:J Mech Sci Technol

Author:

Kwak Jae

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials

Link

http://link.springer.com/content/pdf/10.1007/s12206-014-1109-z.pdf

Reference20 articles.

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3. J. H. Lau, C. P. Wong, J. Prince and W. Nakayama, Electronic packaging: design, materials, process and reliability, New York: McGraw Hill International Edition (1998).

4. MB Vincent and C. P. Wong, Enhancement of underfill encapsulants for flip-chip technology, Solder Surf Mt Technol, 11 (3) (1999) 33–9.

5. SK Tran, DL Questad and BG Sammakia, Adhesion issues in flip-chip on organic modules, Proceedings of intersociety conference on thermal phenomena (1998) 263–8.

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