Strain evolution of flip-chip package with underfill during thermal cycling and high temperature isothermal aging-Reference-Cited by-同舟云学术

Strain evolution of flip-chip package with underfill during thermal cycling and high temperature isothermal aging

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Peng Liang¹,Zhang Zhen'an²,Li Gang¹,Sun Rong¹,Zhu Pengli¹

Affiliation:

1. Chinese Academy of Sciences,Shenzhen Insitute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology,Shenzhen,China

2. Chinese Academy of Sciences Nano Science and Technology Institute University of Science and Technology of China,Shenzhen Institute of Advanced Technology,Shenzhen,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09872607.pdf?arnumber=9872607

Reference12 articles.

1. Underfill constraint effects during thermomechanical cycling of flip-chip solder joints

2. The effects of underfill on the reliability of flip chip solder joints

3. A Mechanistic Study of Underfill Cracks by the Confocal-DIC Method

4. Strain behaviors of solder bump with underfill for flip chip package under thermal loading condition

5. Package warpage measurement of surface-mount integrated circuits at elevated temperature;standard;JESD22-B112,2009

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