Unusual defects, generated by wafer sawing: Diagnosis, mechanisms and how to distinguish from related failures-Reference-Cited by-同舟云学术

Unusual defects, generated by wafer sawing: Diagnosis, mechanisms and how to distinguish from related failures

Published:2008-08 Issue:8-9 Volume:48 Page:1253-1257
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Jacob Peter,Rothkirch Werner

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference9 articles.

1. Teng Cheung, Annette. Dicing advanced materials for microelectronics. In: Proceedings of international symposium on advanced packaging materials: processes, properties and interfaces, March 16–18; 2005. p. 149–152. ISBN: 0-7803-9085-7.

2. Weisshaus I, Shi D, Efrat U. Wafer dicing. Advanced packaging, issued January; 2000. p. 60–3.

3. Assembly processes – a surface electrostatic discharge killer for devices and a FA challenge;Jacob;ASM-EDFAS, Electron Dev Failure Anal,2005

4. Jacob P, Hartfield, C. Tool-related ESD surface damage (ESDFOS) on wafers in Cu-technology. In: ISTFA 2007, proceedings of 33rd international symposium for testing and failures analysis, San José, USA. November 4–8; 2007.

5. Wilbert J. Der Kelvin-Generator als Demonstrationsexperiment zur Elektrostatik. Zulassungsarbeit zum Ersten Staatsexamen für das Lehramt an Gymnasien, Physikal Inst der Universität Erlangen-Nürnberg, März; 1997.

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Backside Analysis Strategy to Identify a Package-Related Failure Mode at an Automotive Magnetic Sensor Device;Journal of Failure Analysis and Prevention;2024-08-23

2. Evaluation of fan-out wafer level package strength;Microelectronics International;2019-04-01

3. Automated image analysis for evaluation of wafer backside chipping;The International Journal of Advanced Manufacturing Technology;2018-08-30

4. Unusual defects, generated by wafer sawing: An update, including pick&place processing;Microelectronics Reliability;2015-08

5. Failure causes generating aluminium protrusion/extrusion;Microelectronics Reliability;2013-09