Automated image analysis for evaluation of wafer backside chipping-Reference-Cited by-同舟云学术

Automated image analysis for evaluation of wafer backside chipping

Published:2018-08-30 Issue:5-8 Volume:99 Page:2015-2023
ISSN:0268-3768
Container-title:The International Journal of Advanced Manufacturing Technology
language:en
Short-container-title:Int J Adv Manuf Technol

Author:

Perminov Valentin,Putrolaynen Vadim,Belyaev Maksim^ORCID,Pasko Elena,Balashkov Kirill

Funder

Ministry of Education and Science of the Russian Federation

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering

Link

http://link.springer.com/article/10.1007/s00170-018-2647-9/fulltext.html

Reference37 articles.

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5. Tang Y, Fuh JYH, Loh HT et al (2008) Laser dicing of silicon wafer. Surf Rev Lett 15:153–159. https://doi.org/10.1142/S0218625X08011147

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