Author:
Jacob Peter,Nicoletti Giovanni
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference4 articles.
1. Electrostatic discharge directly to the chip surface, caused by automatic post-wafer processing;Jacob;Trans Dev Microelectron Reliab,2005
2. Unusual defects, generated by wafer sawing: diagnosis, mechanisms and how to distinguish from related failures. ESREF 2008, maastricht (NL) 29.9.-2.10.2008;Jacob;Special Issue IEEE Trans Dev Microelectron Reliab,2008
3. Silicon based system in package: improvement of passive integration process to avoid TBMS failure;Gautier;Microelectron Reliab,2008
4. Murray, Franck. Silicon based system-in-package and passive integration: a breakthrough in the improvement of system level reliability. Invited speech on ESREF 2007, session F (not published in the proceedings).
Cited by
5 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献