Fatigue life evaluation of wire bonds in LED packages using numerical analysis

Author:

Zhang Sung-Uk,Lee Bang Weon

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. Failure mechanisms and reliability issues in LEDs;Pecht,2013

2. Ciappa M, Fichtner W. Lifetime prediction of IGBT modules for traction applications. In: IEEE 38th IRPS; 2000. p. 210–6.

3. Hager C, Stuck A, Tronel Y, Zehringer R, Fichtner W. Comparison between finite-element and analytical calculations for the lifetime estimation of bond wires in IGBT modules. In: 12th ISPSO; 2000. p. 291–4.

4. Bielen J, Gommans JJ, Theunis F. Prediction of high cycle fatigue in aluminum bond wires: a physics of failure approach combining experiments and multi-physics simulations. In: EuroSimE; 2006. p. 1–7.

5. Matsunaga T, Uegai Y. Thermal fatigue life evaluation of aluminum wire bonds. In: 1st ESTC; 2006. p. 726–31.

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