Thermal Fatigue Life Evaluation of Aluminum Wire Bonds
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/4060679/4060806/04060817.pdf?arnumber=4060817
Cited by 14 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Low Modulus Polyimide Coating on Wedge Bond to Improve Wire Bond Robustness in Thermal Cycling;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
2. Increasing the Reliability of Aluminum Wirebonds by Thermal Treatments: Analysis and Implementation;IEEE Journal of Emerging and Selected Topics in Power Electronics;2023-06
3. Creep Effect on the Crack Growth Rate of Wire Bonds in IGBT Power Modules;IEEE Transactions on Power Electronics;2023
4. Development of In-Situ Measurement Method for Wire-Bonding Lifetime Utilizing the 4-Terminal Method;Journal of Smart Processing;2023
5. Fatigue life evaluation of gold wire bonding solder joints in MEMS pressure sensors;Journal of Micromechanics and Microengineering;2022-12-30
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