Author:
Glowacki A.,Boit C.,Perdu P.,Iwaki Y.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference4 articles.
1. Phang JCH, Chan DSH, Tan SL, Len WB, Yim KH, Koh LS, Chua CM, Balk LJ. A review of near infrared photon emission microscopy and spectroscopy. In: Proceedings of 12th IPFA 2005, Singapore; 2005.
2. Functional IC analysis through chip backside with nano scale resolution – E-beam probing in FIB trenches to STI level;Schlangen;Proc ISTFA,2006
3. Performance improvement of Si-CCD detector based backside reflected light and photon emission microscopy by FIB ultimate substrate thinning;Glowacki;Microelectron Reliab,2011
4. Photon emission spectra through silicon of various thicknesses;Glowacki;ISTFA,2011
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4 articles.
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