Author:
Glowacki A.,Boit C.,Perdu P.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
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4. Glowacki A, Helfmeier C, Kerst U, Boit C. Improvement of optical resolution through chip backside using FIB trenches. In: Proc ASM/EDFAS 36th International Symposium for Testing and Failure Analysis (ISTFA), Dallas TX, USA; 2010. p. 176–80. ISBN: 978-1-61503-041-5.
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