Thermal mapping at the cell level of chips in power modules through the silicone gel using thermoreflectance-Reference-Cited by-同舟云学术

Thermal mapping at the cell level of chips in power modules through the silicone gel using thermoreflectance

Published:2020-02 Issue: Volume:105 Page:113563
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Metayrek Y.,Kociniewski T.,Khatir Z.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference25 articles.

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5. The 2018 GaN power electronics roadmap;Amano1;J. Phys. D. Appl. Phys.,2018

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