Author:
Lu Hua,Bailey Chris,Yin Chunyan
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference11 articles.
1. Power electronic modules;Sheng,2005
2. Present problems of power module packaging technology;Shammas;Microelectron Reliab,2003
3. Pooch M-H, Dittmer KJ, Gabisch D. Investigations on the damage mechanism of aluminum wire bonds used for high power applications. In: Proceedings of the EUPAC 96; 1996. p. 128–31.
4. Günther M, Wolter K, Rittner M, Nüthter W. Failure mechanisms of direct copper bonding substrates. In: Proceedings of electronics systemintegration technology conference (ESTC), Dresden, Germany; 2006. p.714–8.
5. Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling;Dupont;Microelectron Reliab,2006
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