Author:
Ichiki M.,Arimoto T.,Abe S.,Tsukuda M.,Omura I.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference20 articles.
1. About present condition and outlook of packaging technology for a power semiconductor module;Ikeda;J. Smart Process.,2015
2. IGBT scaling principle toward CMOS compatible wafer processes;Tanaka;Solid State Electron.,2013
3. Optimal double sided gate control of IGBT for lower turn-off loss and surge voltage suppression;Harada,2016
4. Trends of intelligent power module;Majumdar;IEEJ Trans. Electr. Electron. Eng.,2007
5. A discussion on IGBT short-circuit behavior and fault protection schemes;Chokhawala;IEEE Trans. Ind. Appl.,1995
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