Author:
Choi U.M.,Lee J.S.,Blaabjerg F.
Funder
National Research Foundation of Korea
Ministry of Land, Infrastructure and Transport
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference7 articles.
1. Power cycling test methods for reliability assessment of power device modules in respect to temperature stress;Choi;IEEE Trans. Power Electron.,2018
2. Power cycling reliability of power module: a survey;Duran;IEEE Trans. Device Mater. Reliab.,2016
3. The GMW3172 Users Guide: Electrical Component Testing;Edson,2008
4. Study on effect of junction temperature swing duration on lifetime of transfer molded power IGBT modules;Choi;IEEE Trans. Power Electron.,2017
5. Model for power cycling lifetime of IGBT modules–various factors influencing lifetime;Bayerer,2008
Cited by
6 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献