Study on Effect of Junction Temperature Swing Duration on Lifetime of Transfer Molded Power IGBT Modules-Reference-Cited by-同舟云学术

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Study on Effect of Junction Temperature Swing Duration on Lifetime of Transfer Molded Power IGBT Modules

Published:2017-08 Issue:8 Volume:32 Page:6434-6443
ISSN:0885-8993
Container-title:IEEE Transactions on Power Electronics
language:
Short-container-title:IEEE Trans. Power Electron.

Author:

Choi Ui-Min,Blaabjerg Frede,Jorgensen Soren

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/63/7886374/07820215.pdf?arnumber=7820215

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