Characteristic of copper wire and transient analysis on wirebonding process

Author:

Hsu Hsiang-Chen,Chang Wei-Yao,Yeh Chang-Lin,Lai Yi-Shao

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference14 articles.

1. Lu MC. Technical introduction to wire bonding. Training manual AA-C-0805. Orient semiconductor electronic; 2008. p. 1.

2. Experimental study of EFO ward electrode wear, surface pollution, and discharge gaps in wire bonding process;Chung;Tamkang J Sci Eng,2003

3. Lim YK, Lim YH, Kamat NR, See A, Lee TJ, Pey KL. Stress-induced voiding beneath vias with wide copper metal leads. In: IEEE physics and failure analysis symposium; 2005. p. 103–6.

4. A study of Cu/low-k stress-induced voiding at via bottom and its microstructure effect;Wang;J Microelectr Reliab,2006

5. Critical study of thermosonic copper ball bonding;Srikanth;Thin Solid Films,2004

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2. Failure Mode and Mechanism Analysis for Cu Wire Bond on Cu/Low-k Chip by Wire Pull Test and Finite-Element Analysis;IEEE Transactions on Device and Materials Reliability;2018-06

3. Comparison of ultrasonic wire bonding process between gold and copper by nonlinear structure analysis;Journal of Adhesion Science and Technology;2018-04-18

4. An Assessment of Risk of Fracture During Wirebond Over Active Circuits on ULK Dies;IEEE Transactions on Components, Packaging and Manufacturing Technology;2016-02

5. Characterization and Modeling of Fine-Pitch Copper Ball Bonding on a Cu/Low-k Chip;Journal of Electronic Materials;2014-12-17

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