Comparison of ultrasonic wire bonding process between gold and copper by nonlinear structure analysis
Author:
Affiliation:
1. Institute of Microsystems, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, PR China
2. School of Mechanical and Electrical Engineering, Hohai University, Changzhou, PR China
Funder
National Natural Science Foundation of China
National High Technology Research and Development Program 863 of China
Research and Development
Publisher
Informa UK Limited
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry
Link
https://www.tandfonline.com/doi/pdf/10.1080/01694243.2018.1463651
Reference21 articles.
1. Challenges and developments of copper wire bonding technology
2. Copper Wire Bonding
3. Overview of wire bonding using copper wire or insulated wire
4. Effect of wire diameter on the thermosonic bond reliability
5. A micromechanism study of thermosonic gold wire bonding on aluminum pad
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