Investigation on structural stability, mechanical properties of AuAl2 doped with Y, Sc and Ta based by first -principles-Reference-Cited by-同舟云学术

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Investigation on structural stability, mechanical properties of AuAl2 doped with Y, Sc and Ta based by first -principles

Published:2024-08 Issue: Volume:40 Page:110174
ISSN:2352-4928
Container-title:Materials Today Communications
language:en
Short-container-title:Materials Today Communications

Author:

Lu Jinkang,Zhan Mingyi,Yu Jie,Yu Xue,Duan Yonghua,Xu Mingli,Lu Wenting,Yang Rongqing

Funder

National Natural Science Foundation of China

Kunming University of Science and Technology

Analysis and Testing Foundation of Kunming University of Science and Technology

Publisher

Elsevier BV

Reference62 articles.

1. Bondability of Pd and Au containing Ag-alloy wires on au pads for LED package;Yuan;IEEE Trans. Compon. Packag. Manuf. Technol.,2020

2. Comparison of ultrasonic wire bonding process between gold and copper by nonlinear structure analysis;Pan;J. Adhes. Sci. Technol.,2018

3. Microstructural indicators for prognostication of copper-aluminum wire bond reliability under high-temperature storage and temperature humidity;Lall;IEEE Trans. Compon. Packag. Manuf. Technol.,2016

4. Reliable material properties of aluminum pads with strong delamination toughness in gold-aluminum wire bonding;Ikeda;Mater. Trans.,2016

5. Interface mechanical behavior of gold alloy wire bonding;Xie;J. Phys. Conf. Ser.,2021

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