1. Berriche R, Lowry R, Rosenfield MI. An oxidation study of Cu leadframes. In: International symposium on advanced packaging materials. Braselton, GA, USA; March 1999. p. 275–81.
2. Effects of moisture and elevated temperature on reliability of interfacial adhesion in plastic packages;Lebbai;J Electron Mater,2003
3. Mohamed Lebbai, Otto YM Lam, Jang-Kyo Kim. Effects of moisture and temperature ageing on reliability of interfacial adhesion with black copper oxide surface. In: 2nd International IEEE conference; June 2002. p. 54–62.
4. The effect of the oxidation of Cu-base leadframe on the interface adhesion between Cu metal and epoxy molding compound;Soon-Jin;IEEE Trans Compon Packag Manuf Technol, Part B,1997
5. Osamu Yoshioka, Norio Okabe, Sadao Nagayama. Improvenment of moisture resistance in plastic encapsulants MOS-IC by surface finishing copper leadframe. Electronic components and technology conference, Piscataway (NJ), United States; 1989. p. 464–71.