The effect of the oxidation of Cu-base leadframe on the interface adhesion between Cu metal and epoxy molding compound-Reference-Cited by-同舟云学术

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The effect of the oxidation of Cu-base leadframe on the interface adhesion between Cu metal and epoxy molding compound

Published:1997-05 Issue:2 Volume:20 Page:167-175
ISSN:1070-9894
Container-title:IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
language:
Short-container-title:IEEE Trans. Comp., Packag., Manufact. Technol. B

Author:

Soon-Jin Cho ,Kyung-Wook Paik ,Young-Gil Kim

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering

Link

http://xplorestaging.ieee.org/ielx4/96/12470/00575569.pdf?arnumber=575569

Cited by 59 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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5. Role of Graphene in Oxidation of Underlying Cu Substrates Elucidated through Angle-Resolved X-ray Photoelectron Spectroscopy: Implications for Corrosion Protection of Graphene/Cu;ACS Applied Nano Materials;2023-02-17

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