Understanding Sulfur-Induced Surface Discoloration On Pre-Plated Leadframes After Prolonged Environmental Exposure-Reference-Cited by-同舟云学术

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Understanding Sulfur-Induced Surface Discoloration On Pre-Plated Leadframes After Prolonged Environmental Exposure

Published:2021-12-07 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
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Author:

Buenviaje Salvador C.,Serapio Rohn Kenneth L.,Magpantay Azeila Fatima D.,Antilano Ernesto T.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9663571/9663865/09663977.pdf?arnumber=9663977

Reference20 articles.

1. Hygroscopic swelling and sorption characteristics of epoxy molding compounds used in electronic packaging

2. Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices

3. Process Optimization Study on Leadframe Surface Enhancements for Delamination Mitigation

4. An analysis on oxidation, contamination, adhesion, mechanical stress and electro- etching effect toward DIP package delamination

5. Reliability of commercial plastic encapsulated microelectronics at temperatures from 125°C to 300°C

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Failure Analysis of QFN Surface Discoloration by Copper Redeposition;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

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