Reliability of commercial plastic encapsulated microelectronics at temperatures from 125°C to 300°C
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/7042/18975/00878520.pdf?arnumber=878520
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4. Interfacial Degradation Mechanism of Au/Al and Alloy/Al Bonds Under High Temperature Storage Test: Contamination, Epoxy Molding Compound, Wire and Bonding Strength;IEEE Transactions on Components and Packaging Technologies;2007-12
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