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Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices

  • Published:1989 Issue: Volume: Page:1-48
  • ISSN:0065-3195
  • Container-title:Speciality Polymers/Polymer Physics
  • language:
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Author:

Kinjo Noriyuki,Ogata Masatsugu,Nishi Kunihiko,Kaneda Aizou,Dušek K.

Publisher

Springer Berlin Heidelberg

Reference132 articles.

1. Peck DS (1970) 8th Ann. Proc. International Reliability Physics Symposium, p81

2. Brauer JB, Kapfer VC, Tamburrino Al (1970) ibid. p61

3. Bevinton JR, Cook JP, Little DR (1970) ibid. p73

4. Yoshida T, Takahashi T (1982) 20th Ann. Proc. International Reliability Physics Symposium, p268

5. Gunn JE, Mazumdar PM (1979) 17th Ann. Proc. International Reliability Physics Symposium, p48

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