Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked Second Reaction
Author:
Affiliation:
1. National Institute of Standards and Technology,Material Measurement Laboratory,Gaithersburg,MD,USA
2. University of Maryland,Department of Mechanical Engineering,College Park,MD,USA
Funder
National Institute of Standards and Technology
Semiconductor Research Corporation
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195584.pdf?arnumber=10195584
Reference17 articles.
1. Glass transition temperature as a function of conversion in thermosetting polymers
2. Differential Scanning Calorimetry (DSC)
3. Kinetics and thermal characterization of thermoset cure
4. Reaction Kinetics in Differential Thermal Analysis
5. Temperature-insensitive silicone composites as ballistic witness materials: the impact of water content on the thermophysical properties
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Deterministic Approach to Obtain Autocatalytic Cure Kinetics Model Constants by Normal Equations of Least-Squares Method;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-04
2. Time-dependent Bulk Behavior of Cured Epoxy Molding Compound;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
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