Deterministic Approach to Obtain Autocatalytic Cure Kinetics Model Constants by Normal Equations of Least-Squares Method
Author:
Affiliation:
1. Mechanical Engineering Department, University of Maryland, College Park, MD, USA
Funder
Semiconductor Research Corporation
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
http://xplorestaging.ieee.org/ielx7/5503870/10523000/10479576.pdf?arnumber=10479576
Reference14 articles.
1. The Application of Differential Thermal Analysis to the Study of Reaction Kinetics1
2. Effect of critical properties of epoxy molding compound on warpage prediction: A critical review
3. Semiconductor Advanced Packaging
4. Cure modeling and monitoring of epoxy/amine resin systems. I. Cure kinetics modeling
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