Effect of Lamination Process-Induced Residual stress on the CTE of Advanced Prepregs Before and After Solder Reflow Process-Reference-Cited by-同舟云学术

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Effect of Lamination Process-Induced Residual stress on the CTE of Advanced Prepregs Before and After Solder Reflow Process

Published:2024-05-28 Issue: Volume:37 Page:131-136
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Kang Byoung-Phil¹,Lee Jong-Yun¹,Kim Jaesung²,Park Jongwoo²,Lee Kyu-Jin³,Jang Yongrae⁴,Han Bongtae⁴

Affiliation:

1. Chungbuk National University,Department of Smart Factory Management,Cheongju,Korea

2. Simmtech,Process Development,Cheongju,Korea

3. Doosan Corporation,Korea

4. University of Maryland,Mechanical Engineering,College Park,MD,USA,20742

Funder

Center for Advanced Life Cycle Engineering

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565190.pdf?arnumber=10565190

Reference16 articles.

1. Design Technologies for Advanced Packaging

2. Logic Technology Scaling to Continue Moore's Law

3. Evaluation of raw substrate variation from different suppliers and processes and their impact on package warpage

4. EMC characterization and process study for electronics packaging

5. Epoxy Molding Compounds as Encapsulation Materials for Microelectronic Devices

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