Electrochemical migration behavior of copper under a thin distilled water layer
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Published:2023-09
Issue:
Volume:11
Page:52-57
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ISSN:2667-2669
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Container-title:Corrosion Communications
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language:en
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Short-container-title:Corrosion Communications
Author:
Qi Kang,Huang Hualiang
Subject
Metals and Alloys