Author:
Tomioka Taizo,Iguchi Tomohiro,Mori Ikuo
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference8 articles.
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3. Yatsuda H. Eimura T. Flip-chip assembly technique for SAW devices. In: Proceedings of the 1995 ISHM International Symposium on Microelectronics, 1995. p. 365–70
4. FUJITSU Corporation, http://pr.fujitsu.com/jp/news/1997/Dec/4.html
5. TOSHIBA Corporation, http://www.toshiba.co.jp/tech/review/1998/03/c05/index_j.htm
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