1. Interface mechanism of ultrasonic flip chip bonding
2. Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound
3. Q. Tan, W. Zhang, B. Schaible, L. Bond, T. Ju, and Y. Lee, 1997 Proceedings 47th Electronic Components and Technology Conference.
4. Q. Tan, B. Schaible, L. Bond, and Y. Lee, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).
5. T. Sugimoto, Y. Morizono, and Y. Ohno, 2006 8th Electronics Packaging Technology Conference (2006).