Response Surface Analysis of Process Parameters for Thermocompression Ultrasonic Flip Bonding of Chips-Reference-Cited by-同舟云学术

Response Surface Analysis of Process Parameters for Thermocompression Ultrasonic Flip Bonding of Chips

Published:2023-04 Issue:4 Volume:13 Page:553-559
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Wang Pengkai¹^ORCID,Wu Yongshuan¹^ORCID,Wu Tianxiang¹^ORCID,Xiao Jinqing¹^ORCID,Zhu Yusheng²,Liu Zhan³^ORCID,Li Junhui¹^ORCID

Affiliation:

1. State Key Laboratory of Precision Manufacturing for Extreme Service Performance and the School of Mechanical and Electronical Engineering, Central South University, Changsha, China

2. Hefei Jingjie Technology Company Ltd., Hefei, China

3. Faculty of Intelligent Manufacturing and the Joint Laboratory of Digital Optical Chip, Wuyi University, Jiangmen, China

Funder

National Natural Science Foundation of China

National Natural Science Foundation of China Joint Fund for Regional Innovation and Development

Youth Innovative Talents Project of Education Department of Guangdong Province

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/10140166/10107471.pdf?arnumber=10107471

Reference21 articles.

1. A novel ultrasonic transducer with multiple vibrations in microelectronic packaging

2. Submodelling method for modelling and simulation of high-density electronic assemblies

3. Novel Functionalized BN Nanosheets/Epoxy Composites with Advanced Thermal Conductivity and Mechanical Properties

4. Au Bump Interconnection with Ultrasonic Flip-Chip Bonding in 20 µm Pitch

5. Microcosmic mechanism and rule of the interfaces in ultrasonic bonding;li,2008

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