Author:
Shi X.Q.,Pang H.L.J.,Zhang X.R.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
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4. Schubert A, Dudek R, Kloeser J, Michel B, Reichl H, Hauck T, et al. Experimental and numerical reliability investigations of FCOB assemblies with process-induced defects. In: Proceedings of 50th Electronics Components & Technology Conference, Las Vegas, USA, May 2000. p. 624–32
5. On the constitutive response of 63/37 Sn/Pb eutectic solder;Skipor;ASME J. Eng. Mater. Technol.,1996
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