Prediction of IGBT junction temperature using improved cuckoo search-based extreme learning machine-Reference-Cited by-同舟云学术

Prediction of IGBT junction temperature using improved cuckoo search-based extreme learning machine

Published:2021-09 Issue: Volume:124 Page:114267
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Liu Boying,Chen Guolong,Lin Hsiung-Cheng,Zhang Weipeng,Liu Jiaqi

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference51 articles.

1. Nonlinear compact thermal model of the IGBT dedicated to SPICE;Gorecki;IEEE Trans. Power Electron.,2020

2. In-situ health monitoring of IGBT modules of an on-line medium-voltage inverter system using industrial internet of things;Ma;CSEE J. Power Energy Syst.,2020

3. Tunnel magnetoresistance-based short-circuit and over-current protection for IGBT module;Shao;IEEE Trans. Power Electron.,2020

4. Remaining useful life estimation for thermally aged power insulated gate bipolar transistors based on a modified maximum likelihood estimator;Ismail;Int. Trans. Electr. Energy Syst.,2020

5. An industry-based survey of reliability in power electronic converters;Yang;IEEE Trans. Ind. Appl.,2011

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