Combined experimental-FEM investigation of electrical ruggedness in double-sided cooled power modules-Reference-Cited by-同舟云学术

Combined experimental-FEM investigation of electrical ruggedness in double-sided cooled power modules

Published:2020-11 Issue: Volume:114 Page:113742
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Scognamillo Ciro,Catalano Antonio Pio,Lasserre Philippe,Duchesne Cyrille,d'Alessandro Vincenzo,Castellazzi Alberto

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference27 articles.

1. An industry-based survey of reliability in power electronic converters;Yang;IEEE Trans. Ind. Appl.,2011

2. Power Electronics for Renewable Energy Systems, Transportation and Industrial Applications;Abu-Rub,2014

3. Electromagnetic considerations for designing double-sided power modules;Mandray;IEEE Trans. Ind. Appl.,2009

4. Planar power module with low thermal impedance and low thermomechanical stress;Cao;IEEE Trans. Compon. Packag. Manuf. Technol.,2012

5. Packaging technology for electronic applications in harsh high-temperature environments;Hagler;IEEE Trans. Ind. Electron.,2010

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Enhancing Electrical Ruggedness in Double-Sided Cooled Power Modules;2024 19th Conference on Ph.D Research in Microelectronics and Electronics (PRIME);2024-06-09

2. Cooling Systems of Power Semiconductor Devices—A Review;Energies;2022-06-22

3. Defect Detection in Double-Sided Cooled Power Modules by Structure Functions;2022 17th Conference on Ph.D Research in Microelectronics and Electronics (PRIME);2022-06-12

4. Influence of a Cooling System on Power MOSFETs’ Thermal Parameters;Energies;2022-04-15

5. Study of the thermal behavior of double-sided cooled power modules;2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2021-09-23