Author:
Infante F.,Perdu P.,Lewis D.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference10 articles.
1. Scanning SQUID microscopy for current imaging;Knauss;Microelectron Reliab,2001
2. Knauss LA, Frazier BM, Christen HM, Silliman SD, Harshavardhan KS, Fleet EF, et al. Detecting power shorts from front and backside of IC packages using scanning SQUID microscopy. In: Proceedings of 25th ISTFA; 1999. p. 11–6.
3. Knauss LA, Orozco A, Woods SI, Zhiyong Wang. Advances in magnetic-based current imaging for high resistance defects and sub-micron resolution. In: Proceedings of 11th IPFA; 2004. p. 267–70.
4. Hsiung S, Tan KV, Komrowski AJ, Sullivan DJD, Gaudestad J, Orozco A, et al. Failure analysis on resistive opens with scanning SQUID microscopy. In: 42nd Annual international reliability physics symposium, IEEE; 2004. p. 611–2.
5. A review of 3-D packaging technology;Al-sarawi;IEEE Trans Comp Pack Manuf Tech Part B,1998
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献