Research on Thermal Aging Mechanism and Methods for Improving Electrical Performance of PCBs in Substation Sensors
Author:
Affiliation:
1. State Grid Smart Grid Research Institute Co., Ltd.,Electric Power Intelligent Sensing Technology Laboratory of State Grid Corporation.,Beijing,China,102209
2. School of Electrical Engineering, Xi'an Jiaotong University,Xi'an,China,710049
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10468576/10468671/10469251.pdf?arnumber=10469251
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3. Magnetic microscopy for 3D devices: Defect localization with high resolution and long working distance on complex system in package
4. Advances in magnetic-based current imaging for high resistance defects and sub-micron resolution
5. Non-destructive defect depth determination at fully packaged and stacked die devices using Lock-in Thermography
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