Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference22 articles.
1. Moore GE, Intel. Cramming more components onto integrated circuits. Electronics (April 19, 1965); 38(8): reproduced in Proc. IEEE, (1998); 86(82).
2. Arden W, Brillouët M, Cogez P, Graef M, Huizing B, Mahnkopf R, ITRS. More than moore white paper. ITRS; 2010.
3. Infante F, CNES, Perdu P, CNES, Lewis D, IMS Laboratories. Magnetic microscopy for 3D devices: defect localization with high resolution and long working distance on complex system in package. ESREF; 2009.
4. Vallett David P, IBM. A comparison of lock-in thermography and magnetic current imaging for localizing buried short-circuits. ISTFA proceedings; 2011.
5. Vallett David P, IBM, Smith Christian, Altman Frank, Fraunhofer-Institute. Enhanced comparison of lock-in thermography and magnetic microscopy for 3D defect localization in system in packages. ISTFA proceedings; 2012.
Cited by
6 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献