Author:
Ko Cheng-Ta,Chen Kuan-Neng
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference36 articles.
1. Lu J-Q, Kwon Y, Jindal A, Lee K-W, McMahon J, Rajagopalan G, et al. In: Proceedings of VMIC; 2002. p. 445–54.
2. International Technology Roadmap for Semiconductors (ITRS); 2004 edition and updates.
3. Beyne E. 3D system integration technologies. In: Symposium on VLSI technology, April 26–28, 2006, Hsinchu, Taiwan.
4. A low temperature wafer bonding technique using patternable materials;Pan;J Micromech Microeng,2002
5. Low temperature full wafer adhesive bonding;Niklaus;J Micromech Microeng,2001
Cited by
140 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献