3D System Integration Technologies-Reference-Cited by-同舟云学术

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3D System Integration Technologies

Published:2006-04 Issue: Volume: Page:
ISSN:1930-885X
Container-title:2006 International Symposium on VLSI Technology, Systems, and Applications
language:
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Author:

Beyne Eric

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4016578/4016579/04016586.pdf?arnumber=4016586

Cited by 23 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Basics of VLSI Design;Understanding Logic Locking;2023-09-23

2. A physical based fatigue model for the micro solder joint in the 3D electronic packagin;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

3. Growth mechanism and kinetics of Cu3Sn in the interfacial reaction between liquid Sn and diversely oriented Cu substrates;Journal of Materials Science: Materials in Electronics;2022-01-21

4. Effect of 3-mercapto-1-propane sulfonate sulfonic acid and polyvinylpyrrolidone on the growth of cobalt pillar by electrodeposition;Nanotechnology Reviews;2022-01-01

5. 2D Layered Materials for Memristive and Neuromorphic Applications;Advanced Electronic Materials;2019-12-11

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