Direct Cu-Cu bonding by low-temperature sintering using three-dimensional nanostructured plated Cu films
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Mechanics of Materials,General Materials Science
Reference19 articles.
1. Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs
2. Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration
3. Wafer-level bonding/stacking technology for 3D integration
4. Brittle fracture of Sn-37Pb solder joints induced by enhanced intermetallic compound growth under extreme temperature changes
5. Formation and behavior of Kirkendall voids within intermetallic layers of solder joints
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Simultaneously performing interlayer copper interconnecting and TSV filling in stacked chips at room temperature based on copper electroplating;AIP Advances;2024-07-01
2. Biochemical Behavior, Influence on Cell DNA Condition, and Microbiological Properties of Wool and Wool–Copper Materials;Materials;2024-06-12
3. Low-Temperature Direct Bonding of Sputtered Nanocrystalline Ag Film for Power Electronic Packaging: Bonding Mechanism, Thermal Characteristics, and Reliability;IEEE Transactions on Power Electronics;2024-05
4. Pillar-Cavity Copper-Copper Bonding for Face-to-Face Carbon Nanotube Synthesis;2023 IEEE CPMT Symposium Japan (ICSJ);2023-11-15
5. Synthesis of Imidazole-Compound-Coated Copper Nanoparticles with Promising Antioxidant and Sintering Properties;Micromachines;2023-11-09
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3