Modified single cantilever adhesion test for EMC/PSR interface in thin semiconductor packages

Author:

Mahan KennyORCID,Kim Byung,Wu Bulong,Han BongtaeORCID,Kim Ilho,Moon Hojeong,Hwang Young Nam

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference45 articles.

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3. A path independent integral and the approximate analysis of strain concentration by notches and cracks;Rice;J. Appl. Mech.,1968

4. Elastic fracture mechanics concepts for interfacial cracks;Rice;J. Appl. Mech.,1988

5. On the J-integral in periodically layered composites;Sun;Int. J. Fract.,1996

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