Mixed mode fracture toughness of epoxy molding compound/printed circuit board interface of semiconductor packages with respect to temperature and moisture-Reference-Cited by-同舟云学术

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Mixed mode fracture toughness of epoxy molding compound/printed circuit board interface of semiconductor packages with respect to temperature and moisture

Published:2023-09 Issue: Volume:289 Page:109429
ISSN:0013-7944
Container-title:Engineering Fracture Mechanics
language:en
Short-container-title:Engineering Fracture Mechanics

Author:

Um Hui-Jin,Lee Se-Min,Lee Dae-Woong,Ha Sangyul,Kim Hak-Sung

Funder

Hanyang University

Ministry of Trade, Industry and Energy

SK Hynix

Korea Institute of Energy Technology Evaluation and Planning

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference25 articles.

1. Hsieh M-C. Advanced flip chip package on package technology for mobile applications. 2016 17th International Conference on Electronic Packaging Technology (ICEPT): IEEE; 2016. p. 486-91.

2. Modified single cantilever adhesion test for EMC/PSR interface in thin semiconductor packages;Mahan;Microelectron Reliab,2016

3. Failure-free integrated circuit packages;Cohn,2004

4. Chemical and mechanical analysis of PCB surface treated by argon plasma to enhance interfacial adhesion;Shin;IEEE Trans Electron Packag Manuf,2009

5. Fracture mechanics of anisotropic materials;Williams,1989

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Advancements in mechanical characterization techniques and environmental effects on bi-material interfaces in microelectronics: a literature review;The Journal of Adhesion;2024-05-09

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