Author:
Durand C.,Klingler M.,Bigerelle M.,Coutellier D.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference20 articles.
1. Solder joint fatigue models: review and applicability to chip scale packages;Lee;Microelectron. Reliab.,2000
2. Solder Joint Reliability – Can Solder Creep?;Hwang;Soldering Surf. Mt. Technol.,1990
3. Fatigue Life Models for SnAgCu and SnPb Solder Joints Evaluated by Experiments and Simulations;Schubert,2003
4. Accumulated Creep Strain and Energy Density Based Thermal Fatigue Life Prediction models for SnAgCu Solder Joints;Syed,2004
5. Correlation Between Power Cycling and Thermal Cycling Fatigue Reliabilities of Chip-Scale Packages;Wang,2004
Cited by
34 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献