Prediction of Defect Distribution in Solder Joint Using Device Stress Toward Prognostic Health Management of Power Modules-Reference-Cited by-同舟云学术

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Prediction of Defect Distribution in Solder Joint Using Device Stress Toward Prognostic Health Management of Power Modules

Published:2023-09 Issue:9 Volume:13 Page:1344-1352
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Usui Masanori¹^ORCID,Kuwahara Makoto¹,Okachi Ryosuke¹,Muramatsu Junya¹

Affiliation:

1. Toyota Central Research and Development Laboratories Inc., Nagakute, Japan

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/10287668/10237253.pdf?arnumber=10237253

Reference18 articles.

1. Prognostics and Health Management of Electronic Packaging

2. Behavior of stress generated in semiconductor chips with high-temperature joints: Influence of mechanical properties of joint materials

3. Degradation Estimation and Prediction of Electronic Packages Using Data-Driven Approach

4. Thermal Stress Simulation for HV Inverter Module

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